Recent reports suggest Apple is looking to launch an ultra-thin iPhone 17 in 2025. However, it appears this plan by the iPhone manufacturer is encountering problems.
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| Apple is facing difficulties in producing the ultra-thin iPhone 17. |
According to analyst Ming-Chi Kuo, Apple has reportedly canceled plans to use resin-coated copper (RCC) for the main circuit boards in the iPhone 17 series launching next year.
Using RCC components will allow the company to reduce internal space requirements, thereby creating a thinner design or even a larger battery for future iPhones.
However, concerns about durability and fragility seem to be the reason behind Apple's decision to delay. Kuo stated, "RCC was unable to meet Apple's high quality requirements. Therefore, Apple was forced to cancel plans to use this material in the iPhone 17 product line."
According to some earlier reports, Apple was expected to use a new design on the iPhone 16 series. However, the changes were delayed until the iPhone 17, with the goal of reserving it for the iPhone 17 Slim to replace the poorly selling iPhone Plus line.
Currently, the iPhone manufacturer continues to delay these upgrades until an indefinite time. iFans will have to wait even longer to enjoy an iPhone with an ultra-thin design.
Source: https://baoquocte.vn/apple-tri-hoan-viec-ra-mat-iphone-17-sieu-mong-279183.html
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