High-bandwidth memory (HBM), is a key component in artificial intelligence (AI) computing. Nikkei Asia said that CXMT has ordered and received a number of production and testing equipment from American and Japanese suppliers to assemble and produce HBM, in the context of Beijing seeking to limit negative impacts from Limit Washington's exports and reduce dependence on foreign technology. 

Currently HBM is not on the US export control list, but Chinese companies themselves still do not have enough capacity to produce "large scale" of this type of component.

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This advancement puts CXMT behind leading US memory chip manufacturers Micron and South Korea's SK Hynix in terms of technology, and ahead of Taiwan's Nanya Technology (China). 

Headquartered in Hefei, eastern China, CXMT is the country's leading random access dynamic memory chip manufacturer. Sources said that since last year, the company has prioritized developing technologies that stack DRAM chips vertically together to replicate the architecture of HBM chips.

DRAM chips are a key component for everything from computers and smartphones to servers and connected cars, allowing processors to access data quickly during calculations. Layering them into HBM will expand communication channels, allowing for accelerated data transmission.

HBM is a potential field for accelerating computing and applying artificial intelligence. The Nvidia H100 chip, the computing power behind ChatGPT, combines a graphics processor with six HBMs to enable fast, human-like responses.

Founded in 2006, CXMT announced late last year that it had begun domestic production of the first LPDDR5 memory chip – a popular mobile DRAM suitable for high-end smartphones. According to the company, Chinese smartphone manufacturers such as Xiaomi and Transsion have completed the integration of CXMT's mobile DRAM chips.

This advancement puts CXMT behind leading US memory chip manufacturers Micron and South Korea's SK Hynix in terms of technology, and ahead of Taiwan's Nanya Technology (China). However, CXMT will account for less than 1% of the global DRAM market in 2023, while the three dominant companies – Samsung, SK Hynix and Micron – control more than 97%.

Meanwhile, HBM production is dominated by the world's two largest DRAM chip makers, SK Hynix and Samsung, which together control more than 92% of the global market by 2023, according to Trendforce. Micron, which has about 4% to 6% market share, is also looking to expand its market share.

Manufacturing HBM not only requires the ability to produce high-quality DRAM, but also requires specialized chip packaging techniques to link those chips together. China still doesn't have a local chipmaker that can produce HBM chips to accelerate AI computing.

(According to Nikkei Asia)

China narrows the mobile memory chip gap with South Korea and the USA leading Chinese semiconductor company has successfully produced a new generation of advanced mobile memory chips for the first time, an important step in narrowing the gap with its Korean and American rivals.