Technology helps increase chip production by 50%.

ASML, a technology company, has just announced a significant breakthrough in extreme ultraviolet (EUV) lithography technology. With a brand-new 1,000-watt light system, the machine is capable of firing three laser beams at 100,000 tin droplets per second. This improvement not only increases chip production speed by 50% by 2030 but also promises to significantly reduce manufacturing costs, ushering in a new era for the entire semiconductor industry.

ASML recently confirmed they are on track to launch the next-generation Twinscan NXE lithography system. This system is equipped with a 1,000-watt EUV power source and can process up to 330 semiconductor wafers per hour.

Expected to launch in 2030 or later, this machine will offer over 50% more power than the most advanced EUV tools currently available. These devices will help chip manufacturers significantly increase productivity and minimize the cost per semiconductor disk. However, to realize this ambition, ASML has had to overcome a series of challenges and make significant technological advancements.

Representatives from ASML's technology team shared that achieving one kilowatt of power is an incredibly impressive accomplishment. The company even sees a clear development path toward 1,500 watts and believes that reaching 2,000 watts is entirely possible in the future.

To achieve a 1,000-watt EUV source within the next decade, ASML had to develop an entirely new light generation method using three laser pulses. This method involves a first sub-pulse to flatten the tin droplets, a second sub-pulse to expand them, and finally, a main laser pulse that transforms these tin droplets into a plasma state to emit EUV light.

In addition, the new system will be equipped with an advanced tin droplet generator, doubling the operating capacity to 100,000 tin drops per second.

However, increasing the number of tin droplets means that more debris will be ejected. Therefore, the system requires a completely new debris collector to ensure the semiconductor disk surface remains absolutely clean.

Furthermore, generating 1,000 watts of radiation is difficult, but transmitting that energy to the semiconductor disk is even more challenging. Therefore, ASML invented a completely new high-transmission optical lens system, designed to scale processing capabilities to over 450 semiconductor disks per hour.

Higher light output also requires a comprehensive upgrade of the mounting and movement systems for the semiconductor wafers.

This powerful light source requires next-generation photoresist chemical materials and protective films. This means that not only ASML, but the entire chip manufacturing industry ecosystem must be prepared for the arrival of these new tools.

Currently, ASML has detailed plans to integrate a 1,000-watt light source into its product roadmap. The next generation of lithography machines is expected to be launched sequentially from 2027 to 2029.

Source: https://baophapluat.vn/cong-nghe-giup-tang-50-san-luong-chip.html