MediaTek Announces Dimensity 7300 and Dimensity 7300X Chips

MediaTek announced the Dimensity 7300 and Dimensity 7300X, a pair of ultra-efficient 4nm chipsets for high-end mobile devices.

MediaTek Dimensity 7300

Both Dimensity 7300 chipsets feature an 8-core CPU, consisting of 4 Arm Cortex-A78 cores operating at a clock speed of 2.5GHz combined with 4 Arm Cortex-A55 cores. The 4nm process reduces the power consumption of the A78 cores by up to 25% compared to the Dimenisty 7050.

The CPU works together with the latest Arm Mali-G615 GPU and MediaTek HyperEngine optimization suite to accelerate the gaming experience. Compared to competing solutions, the Dimensity 7300 series delivers 20% faster FPS and 20% improved power efficiency.

To further enhance the gaming experience, these new chips use intelligent resource optimization technology, optimize 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.

“MediaTek Dimensity 7300 chips will play a key role in integrating the latest AI innovations and connectivity features that enable consumers to stream and play games seamlessly,” said Dr. Yenchi Lee, Vice President of Wireless Communications Business at MediaTek. “Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors with dual-screen support,” said Dr. Yenchi Lee.

The Dimensity 7300 chipsets also take photography to the next level with the MediaTek Imagiq 950, featuring a premium 12-bit HDR-ISP that supports up to 200MP primary cameras. Enhanced with new hardware tools that deliver precision noise reduction (MCNR), face detection (HWFD), and HDR video , the Dimensity 7300 enables users to capture stunning photos and videos in any lighting condition.

Additionally, live focus shooting performance is up to 1.3x faster and image reproduction is up to 1.5x faster than the Dimensity 7050. Users can also shoot 4K HDR video with 50% wider dynamic range than competing solutions, revealing more details in video.

Other technologies of the Dimensity 7300 and Dimensity 7300X include:

MediaTek 5G UltraSave 3.0+ technology combines a complete suite of R16 power-saving enhancements, plus MediaTek's own optimizations that deliver 13-30% higher power efficiency than competing solutions in common sub-6GHz 5G connectivity scenarios.

Supports 5G downloads up to 3.27Gb/s with 3CC Carrier Aggregation technology, providing faster download speeds in urban and suburban environments.

Tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless connections and simultaneous dual 5G SIM support with dual VoNR for more user choice.

KIM THANH

Source: https://www.sggp.org.vn/mediatek-cong-bo-chip-dimensity-7300-va-dimensity-7300x-post742221.html