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The front camera on the iPhone 18 Pro may utilize new technology. Photo: MacRumors . |
Some sources indicate that Apple is preparing a significant change to its high-end iPhone lineup launching in 2026. Accordingly, the iPhone 18 Pro and iPhone 18 Pro Max may abandon the familiar pill-shaped punch-hole camera design, replacing it with a single punch-hole located in the upper left corner of the screen.
According to an article published by the tech website The Information , Apple is expected to completely eliminate the punch-hole design on the iPhone 18 Pro series. Instead, the device will use a single punch-hole front camera, combined with Face ID facial recognition technology placed under the screen. If this information is accurate, this would be one of the biggest changes to the iPhone's front design in many years.
The revelations from The Information also coincide with previous leaks from the @DigitalChatStation account on the social media platform Weibo in November. This source stated that Apple was testing a new display solution on the iPhone 18 Pro, in which the punch-hole cutout was significantly reduced in size thanks to HIAA technology.
Besides the screen changes, the prototype features a main camera with a different aperture, larger horizontal bezels, and a transparent back panel. The Pro Max version is also expected to be the first to use a battery with a steel casing.
HIAA stands for Hole-In-Active-Area. This is a display manufacturing technology that allows for the drilling of ultra-small holes directly into the pixel area of an OLED panel using high-precision lasers. This allows for the optimal size of the front camera cutout while maintaining display quality.
Compared to under-display camera (CUP/UPC) solutions, which completely conceal the camera and reduce image quality, HIAA is considered a better balance in the current market. This technology still maintains an exposed camera, but at a minimum size, helping to ensure the quality of selfies.
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The iPhone 18 Pro may come in at least one new color. Photo: iDrop . |
In terms of specifications, the iPhone 18 Pro series will use the A20 Pro chip, manufactured on TSMC's advanced 2nm process. This chip is expected to incorporate CoWoS packaging technology, allowing for tight integration between the CPU, unified memory, and neural processor, thereby improving overall performance and AI processing capabilities.
In terms of connectivity, the iPhone manufacturer may continue its hardware autonomy strategy with its own C1X or C2 modem, coupled with the N1 network chip. To ensure stable performance during heavy use, the Pro models will feature a stainless steel vapor chamber cooling system.
In terms of photography capabilities, the iPhone 18 Pro is expected to use a triple-layer stacked image sensor to improve quality. Apple is also testing new color options such as brown, purple, and burgundy, one of which may be chosen for the final commercial version.
Source: https://znews.vn/iphone-18-pro-sap-co-camera-truoc-duc-lo-post1612296.html








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