According to WCCFtech , Apple will announce the A17 Bionic SoC on TSMC's next-generation 3nm process this year, which is expected to power the iPhone 15 Pro and iPhone 15 Pro Max. A report says the Taiwanese chip giant will ramp up 3nm chip production later this year, increasing monthly output to 100,000 wafers.
According to a report published in Economic Daily News , TSMC is gradually increasing its production capacity to 90,000 - 100,000 wafers per month. Most of it will be used for the A17 Bionic chip in the iPhone 15 Pro and iPhone 15 Pro Max. However, the information does not mention the percentage of orders that will be made to Apple.
Apple is said to have ordered 90% of TSMC's 3nm wafers this year
However, an earlier report said that Apple had “underwritten” 90% of TSMC’s 3nm chip shipments, suggesting that the company wanted to get ahead of its rivals in releasing before the likes of Qualcomm, MediaTek, and others had access to the technology. Competitors are holding back on 3nm due to high wafer costs, and it’s likely that Apple will also be bearing the brunt of those costs.
TSMC is reportedly open to making concessions if its monthly production reaches 100,000 wafers by the end of 2023. The price hike means the iPhone 15 Pro and iPhone 15 Pro Max will be more expensive than their predecessors. But one way to cut costs is for TSMC to switch from the N3B process to the N3E process, but rumors suggest the switch will reduce the performance of the A17 Bionic.
Foxconn is said to begin mass production of the iPhone 15 Pro and iPhone 15 Pro Max later this June, with an initial shipment target of around 90 million units. However, since the Pro models will have more exclusive upgrades than the iPhone 14 Pro and iPhone 14 Pro Max, Apple's supply chain partners may be ready for this change.
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