Forecasts indicate a surge in US AI chip production.

By 2030, the US is projected to account for more than 20% of global production of advanced semiconductors used in applications such as artificial intelligence.

The outlook is improving.

This information was reported by Nikkei Asia, citing a new report from market research firm TrendForce. According to the report, this result stems from the US attracting investment from Taiwanese and South Korean chip manufacturers.

TrendForce forecasts that the US will account for 22% of global production capacity for advanced logic semiconductors by 2030, double the figure from 2021. Meanwhile, during the same period, Taiwan's market share in this sector is expected to decrease from 71% to 58%, and South Korea's from 12% to 7%.

The semiconductor shortage during the Covid-19 pandemic prompted the U.S. to pour resources into attracting chip manufacturers to build domestic production facilities to ensure a stable supply of these critical commodities. Rising geopolitical risks, including tensions between China and the U.S., provided further impetus.

Intel's headquarters in California (USA)

Changing the situation

The U.S. is focusing on manufacturing logic semiconductor components, particularly advanced chips used in data centers, telecommunications, and military hardware. Logic chips are also crucial for competing in artificial intelligence (AI). While the American corporation NVIDIA has a near-monopoly on AI chip design, the U.S. largely relies on Taiwan for manufacturing.

In the US, since 2020, the private sector has announced investments totaling over $500 billion in the semiconductor industry. This is an effort to revive the US semiconductor manufacturing industry, which held a 37% global market share in 1990 but had fallen to 10% by 2022. This downward trend is expected to reverse starting this year as major semiconductor manufacturing projects become operational.

TSMC (Taiwan) recently announced it will invest an additional $100 billion in the US to build three more facilities, including two factories for advanced packaging processes and one research and development center. The packaging of logic semiconductor chips and high-performance memory – essential for AI – is primarily concentrated in Taiwan. Therefore, TSMC establishing packaging facilities in the US will further strengthen its domestic supply chain.

In addition, Reuters recently cited several close sources revealing that two American corporations, NVIDIA and Broadcom, are testing the same chip manufacturing system as Intel (USA) – a corporation that has invested heavily in chip foundry but without much success. If the tests are successful and Intel becomes a manufacturer for NVIDIA and Broadcom, the shift of advanced semiconductor chip production to the US will become even stronger.

Source: https://thanhnien.vn/du-bao-san-luong-chip-ai-cua-my-tang-cao-185250311181214009.htm