Weibo social media account Fixed Focus Digital predicts that the next-generation Kirin CPU with Taishan V130 cores can match the performance of the Apple M3. "This is a chip specifically designed for AI terminal products, and the memory bandwidth is twice that of previous PC chips," the account said.

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Huawei's next-generation chips could use the same technology as Apple Silicon or Intel Core Ultra. Photo: Yahoo Tech

Huawei was one of the world's leading smartphone makers before it was blacklisted by Washington, and at the time, the tech giant was said to be developing its own silicon chips.

However, without access to the latest chips from Qualcomm, Intel and TSMC's advanced foundry lines, Huawei is forced to research and develop its own chip hardware.

Since then, the company has made some progress, such as the Kirin 9000S chip manufactured on SMIC’s 7nm process. However, that is not enough when compared to TSMC’s more advanced node technology. Even the company’s Ascend 910B AI processor has suffered from poor yields, with 80% of the chips produced being defective.

Therefore, the UMA unified DRAM technology on the IC platform promises to be the answer to this performance problem. Huawei may be developing a chip to compete with Qualcomm's Snapdragon X, with a 45 TOP NPU. However, even then, it is unclear whether the chip will be able to run Microsoft's AI features.

(According to Yahoo Tech)

Huawei was once unable to produce a 5G phone on its own . Richard Yu Chengdong, a senior executive of Huawei, said the group faced "extremely difficult" times when it was blacklisted by Washington.