According to Sparrowsnews , the key to innovation in the iPhone 16 lies in a new material that promises to revolutionize the way printed circuit boards (PCBs) are manufactured, offering a range of benefits that could reshape the future of smartphones.
The change in PCB design marked a turning point for the iPhone 16 series.
The key to this development revolves around the use of resin-bonded copper foil (RCC) as a new circuit board material. This switch promises to make PCBs thinner, thereby freeing up valuable space inside devices like iPhones and smartwatches. The implications of this are significant because the new space can accommodate larger batteries or other essential components, ultimately enhancing the overall user experience.
Beyond its thinness, RCC-coated copper foil offers several advantages over its predecessors. One notable benefit is its improved dielectric properties, allowing for seamless high-frequency signal transmission and faster digital signal processing on the circuit board. Furthermore, the flatter surface of RCC paves the way for the creation of more intricate and complex designs, underlining Apple's commitment to precision engineering.
Apple is also taking an innovative approach to chip manufacturing with the iPhone 16 series. According to reliable sources, the company is willing to reduce production costs by using a separate process for the A17 chip, which will power the iPhone 16 and 16 Plus. While the A17 Pro in the iPhone 15 Pro was manufactured using TSMC's N3B process, the A17 in the iPhone 16 series will use the more cost-effective N3E process.
Apple's vision for the iPhone 16 series represents a significant leap forward in smartphone innovation. The incorporation of RCC-bonded copper foil for PCBs and strategic adjustments in the chip manufacturing process underscore Apple's relentless pursuit of excellence. These advancements promise to reshape the smartphone landscape, delivering a more efficient and enhanced mobile experience for users.
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