According to Tech News Space , TSMC CEO Mark Liu shared the company's plans in a recent meeting with analysts and investors, expressing confidence that mass production of chips using 2nm process technology will begin as early as 2025. He mentioned TSMC's intention to establish multiple manufacturing facilities in Hsinchu Science Park and Kaohsiung (Taiwan) to meet growing demand.
TSMC aims to mass produce 2nm chips in the second half of 2025
Specifically, the first plant will be located near Baoshan (Hsinchu), near the R1 research center - a place specifically established to develop 2nm technology. The plant is expected to begin mass production of 2nm semiconductors in the second half of 2025. The second plant, also designed to produce 2nm chips, will be located in Kaohsiung Science Park, part of the Southern Taiwan Science Park, with plans to begin operations in 2026.
In addition, preparations are underway to build a third plant, which will begin after the company receives approval from Taiwanese authorities.
In addition, TSMC is actively working to obtain approval from the authorities in Taiwan to build another fab at the Taichung Science Park. If construction begins in 2025, production will begin in 2027. By opening all three fabs capable of producing chips using 2nm technology, TSMC will significantly strengthen its position in the global semiconductor market and provide customers with new capacity to produce next-generation chips.
The company's near-term plans include starting mass production with 2nm process technology, with the company aiming to use nanosheet-type gate all-round (GAA) transistors in the second half of 2025. An improved version of the process expected in 2026 will integrate power from the back of the chip, thereby expanding mass production capabilities.
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