Another major upgrade of the 20th anniversary iPhone

SK Hynix's HBM booth. Photo: Shutterstock .

According to a report from ETNews , the 2027 iPhone - the 20th anniversary version of its launch - is said to be developing many technological innovations, notably high-bandwidth memory chips for phones (MHBM).

HBM is essentially a stack of memory chips with small components that store data. They can store more information and transfer data faster than dynamic random access memory, or DRAM.

According to PhoneArena , because HBM allows for smaller RAM chips, the technology could help develop thinner iPhone models or variants with larger battery capacities.

In particular, connecting Mobile HBM to the GPU on iPhone models expected to appear in 2027 could allow running large language models (LLMs) right on the device without consuming too much battery or increasing the phone's latency.

The source added that Apple may have discussed its plans with major memory suppliers such as Samsung Electronics and SK hynix, both of which are developing their own versions of Mobile HBM.

Samsung is said to be using the VCS packaging method, while SK hynix is ​​working on the VFO method. Both are aiming for mass production sometime after 2026.

In addition to AI support, in a Power On article on Bloomberg , analyst Mark Gurman revealed that an iPhone model “made mostly of glass, curved and with a notch-free screen” could be launched by the end of 2027. According to Gurman, this device marks the 10th anniversary of the launch of the iPhone X, the product that started the trend of thin-bezel iPhones.

Users can also look forward to Apple's first smart glasses. The device will look similar to the Meta Ray-Ban, support smart features but not be as bulky as the Vision Pro.

Source: https://znews.vn/them-nang-cap-lon-cua-iphone-ban-ky-niem-20-nam-post1553743.html