 |
Illustration of the iPhone 18 Pro design based on rumors. Photo: MacRumors . |
In a recent article on GF Securities, analyst Jeff Pu stated that several iPhone models launching in 2026, including the iPhone 18 Pro, iPhone 18 Pro Max, and the foldable iPhone (tentatively called the iPhone 18 Fold), will feature the Apple A20 chip.
Based on rumors, the A20 will have several major design upgrades compared to the A18 chip (used in the iPhone 16) and the A19 chip (expected to be featured in the iPhone 17).
The A20 chip is manufactured using TSMC's 2nm process (N2). For comparison, the A18 chip series uses the second-generation 3nm process (N3E), while the A19 chip will have the third-generation 3nm process (N3P).
The transition from 3nm to 2nm is expected to begin with the iPhone 18 Pro and iPhone 18 Fold. According to MacRumors , the smaller process size means each chip contains more transistors, resulting in increased performance and optimized power consumption.
Based on rumors, the A20 chip is expected to offer 15% higher performance and up to 30% better energy efficiency compared to the A19. It's important to note that the 3nm or 2nm figures are primarily used by TSMC for marketing purposes and do not represent the actual chip size.
Back in March, analyst Ming-Chi Kuo from TF International Securities also predicted that the A20 chip would be manufactured using a 2nm process. At that time, Kuo stated that TSMC was ramping up trial production of 2nm chips.
In addition to the 2nm process, Pu stated that the A20 chip will utilize TSMC's new packaging technology, called WMCM (Wafer-Level Multi-Chip Module).
The new design allows RAM to be integrated directly onto the wafer along with the CPU, GPU, and Neural Engine, instead of being located next to the chip and connected via a bridge or silicon interposer.
These changes could benefit the iPhone 18 Pro and iPhone 18 Fold, such as faster Apple Intelligence, optimized battery life, and better temperature management. It also helps to shrink the A20 chip, creating space for other components.
Jeff Pu stated that TSMC is building a dedicated production line for WMCM designs, expected to be operational by the end of 2026.
“TSMC will establish a dedicated WMCM production line at its AP7 facility, leveraging equipment and processes similar to CoWoS-L packaging technology but without the need for a substrate.”
"Our information indicates that TSMC is preparing a production line with a maximum capacity of 50 KPM (50,000 wafers per month) by the end of 2026, estimated to increase to 110-120 KPM by the end of 2027 when the technology is widely adopted," the analyst said.
Source: https://znews.vn/cong-nghe-dot-pha-cua-iphone-18-pro-post1558259.html
Comment (0)