Notable upgrades on the 20th anniversary iPhone

SK Hynix's HBM3E memory chip. Source: Bloomberg g

According to a report from ETNews , the 2027 iPhone - the 20th anniversary version of its launch - is said to be developing many technological innovations, notably high-bandwidth memory (HBM) chips.

HBM is essentially a stack of memory chips with small components that store data. They can store more information and transfer data faster than dynamic random access memory, or DRAM.

With this advantage, HBM chips are often used in graphics cards, high-performance computer systems, data centers, and autonomous vehicles.

Most importantly, HBM is an indispensable component for running increasingly popular artificial intelligence applications, including generative AI with support from Nvidia's graphics processing units (GPUs).

According to ETNews , the version used on the iPhone will be Mobile HBM, a variant of this technology for mobile devices that is designed to provide very high data throughput and minimize power consumption and physical size of RAM chips.

The source also revealed that Apple is looking to enhance AI capabilities on the iPhone, and connecting Mobile HBM to the iPhone's GPU units is being considered as a strong candidate to achieve this goal.

The source added that Apple may have discussed its plans with major memory suppliers such as Samsung Electronics and SK hynix, both of which are developing their own versions of Mobile HBM.

Samsung is said to be using the VCS packaging method, while SK hynix is ​​working on the VFO method. Both are aiming for mass production sometime after 2026.

Source: https://znews.vn/nang-cap-dang-chu-y-tren-iphone-ban-ky-niem-20-nam-post1553268.html