Samsung expands HBM chip packaging plant

South Korea's leading technology group, Samsung Electronics, has announced the expansion of its semiconductor packaging facilities in South Chungcheong Province to boost production of high-bandwidth memory (HBM) chips and the transfer of 128 patents to small companies.

Samsung Electronics will convert an unused liquid crystal display (LCD) plant of Samsung Display in Cheonan, about 85 kilometers south of Seoul, into a semiconductor manufacturing plant, according to a memorandum of cooperation with the South Chungcheong Provincial Government today (November 12).

Samsung expands packaging plant to boost production of high-bandwidth memory chips.

The new facilities, scheduled for completion by December 2027, will feature advanced packaging lines for HBM chips, which are in high demand due to their essential role in artificial intelligence (AI) computing. Packaging is a critical stage in the semiconductor manufacturing process, protecting chips from mechanical and chemical damage.

Samsung Electronics hopes the upgraded facilities in Cheonan will help it regain its competitive edge in the global semiconductor market. The world’s largest memory chipmaker has recently fallen behind domestic rival SK hynix in the high-bandwidth chip segment.

Samsung Electronics' plan to supply its latest 5th generation HBM3E products to Nvidia has been delayed due to quality concerns from the US tech giant.

Along with the project to expand semiconductor packaging capacity for HBM memory production, Samsung Electronics also announced sharing more than 100 patents with smaller businesses in an effort to promote joint growth.

South Korea's top tech giant has transferred 128 patents to 85 companies this year to support the development of innovative products and solutions without paying royalties, according to the Ministry of Trade, Industry and Energy.

Samsung Electronics first launched the program in 2015 and has provided a total of 1,210 patents to 673 companies so far.

The latest suite of technologies includes a route recommendation system using user biometric data, a screen control method based on eye movement tracking, and a solution for wireless data sharing between TVs and smartphones by scanning radio frequency identification tags.

"South Korea will continue to support small and medium-sized enterprises in developing new products and business models to promote innovative growth through a technology sharing program," the ministry said in a statement.

(Source: Yonhap)

Source: https://www.baogiaothong.vn/samsung-mo-rong-nha-may-dong-goi-chip-hbm-192241112163615151.htm