Intel Makes Breakthrough with Glass Substrate

According to Engadget , Intel says its new glass substrate will be more durable and efficient than existing organic materials. Glass will also allow the company to place multiple chiplets and other components side by side, which could pose challenges for the company in terms of bending and instability compared to existing silicon packages that use organic materials.

Intel Shows Breakthrough in Substrate Manufacturing Technology

“The glass substrates can withstand higher temperatures, have 50 percent less pattern distortion, and have extremely low flatness to improve depth of focus for lithography, while also providing the dimensional stability needed for extremely tight interlayer bonding,” Intel said in a press release.

With these capabilities, the company claims the glass substrate will also help increase interconnect density by up to 10 times, as well as enable the creation of “ultra-large-sized packages with high assembly yield.”

Intel is investing heavily in the design of its future chips. Two years ago, the company announced its “gate-all-around” transistor design, RibbonFET, as well as PowerVia, which allows it to move power to the back of a chip’s wafer. It also announced it would build chips for Qualcomm and Amazon’s AWS service.

Intel added that we will first see chips using glass in high-performance areas like AI, graphics, and the data center. The glass breakthrough is another sign that Intel is also ramping up its advanced packaging capabilities at its US foundries.

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