Apple will create a breakthrough for iPhone 17 with a super thin motherboard

According to Sparrowsnews , news of the plan to develop plastic-coated copper foil for PCBs first appeared in September this year. With RCC, Apple can create thinner PCBs. However, expert Ming-Chi Kuo said that due to obstacles in the development process, Apple may not deploy RCC technology until 2025 at the earliest, which is the year the iPhone 17 series is launched.

Thinner PCBs will help improve battery life for iPhone 17

By reducing PCB thickness using RCC, valuable space inside compact devices like the iPhone or Apple Watch will be freed up. This will allow Apple to include larger batteries or add other essential components that improve device performance and battery life. The main advantage of RCC is that it does not contain glass fibers, which simplifies drilling operations during manufacturing.

However, despite its potential, Apple has encountered challenges due to its “fragile nature” and RCC’s failure to pass drop tests. To improve the properties of RCC, Apple is said to be working with Ajinomoto, a major supplier of RCC materials. Kuo believes that if this cooperation yields good results in Q3 2024, Apple may consider implementing RCC technology on high-end iPhone 17 models in 2025.

For consumers, while Apple’s pursuit of thinner PCBs has been delayed, it also signals a commitment to delivering durable and reliable devices. Apple’s dedication to innovation and product excellence remains steadfast in its goal of enhancing the user experience through advanced technology. All of this sets the stage for a better future for the high-end iPhone 17 models when they launch in 2025.

Source link: https://thanhnien.vn/apple-se-tao-dot-pha-cho-iphone-17-bang-bo-mach-chu-sieu-mong-185231014002225444.htm