What are the standout features of the Pixel 8's Tensor 3 chip?

Although the Pixel 8 doesn't seem to have major upgrades beyond some notable software features, a recent report has sparked curiosity about this upcoming smartphone.

The Google Pixel 8 phone is expected to launch on October 4th.

According to a tweet by Revegnus, the new Tensor G3 chip inside the Pixel 8 series will incorporate FO-WLP (fan-out wafer-level packaging) technology, which reduces heat generation and increases power efficiency, according to GizmoChina .

Companies like Qualcomm and MediaTek have used this technology to improve performance and keep their chips cooler. This will be the first time Samsung Foundries, the manufacturer of the Tensor G3 chip for Google, has implemented this technology.

While the Tensor G3 may not have set any performance records, its ability to run at lower temperatures than the G2 could become a significant selling point for the Pixel 8 series. This is especially meaningful since the Pixel 7 has already faced challenges in maintaining acceptable temperatures during routine and demanding tasks.

However, there are rumors that Google intends to break free from its dependence on Samsung. Reports suggest the company plans to design and manufacture its own complete chips internally, potentially using TSMC's 4nm process.

The Pixel 8's Tensor 3 chip runs cooler than previous phone models.

Source link: https://thanhnien.vn/chip-tensor-3-cua-pixel-8-co-diem-noi-bat-gi-185230914155129704.htm