What's so special about the Pixel 8's Tensor 3 chip?

While the Pixel 8 doesn't seem to have major upgrades beyond some notable software features, a recent report has sparked curiosity about the upcoming smartphone.

Google Pixel 8 phone expected to launch on October 4

According to a tweet by Revegnus, the new Tensor G3 chip inside the Pixel 8 series will integrate FO-WLP (fan-out wafer-level packaging) packaging technology, which helps reduce heat generation and increase power efficiency, according to GizmoChina .

Companies like Qualcomm and MediaTek have used the technology to improve performance and keep their chips cooler. This will be the first time Samsung Foundries, which makes Google's Tensor G3 chips, has implemented the technology.

While the Tensor G3 may not set any performance records, the ability to run at lower temperatures than the G2 could become a significant selling point for the Pixel 8 series. This is especially significant since the Pixel 7 has struggled to maintain acceptable temperatures during regular and heavy tasks.

However, there are rumors that Google is looking to move away from its reliance on Samsung. Reports suggest that the company plans to design and manufacture chips entirely in-house, potentially using TSMC's 4nm process.

The Pixel 8's Tensor 3 chip runs cooler than previous phones

Source link: https://thanhnien.vn/chip-tensor-3-cua-pixel-8-co-diem-noi-bat-gi-185230914155129704.htm