The Fab-Lab project is considered a pioneering model in Vietnam in the field of integrated circuit packaging, with strategic significance in developing core technologies, concretizing Resolution No. 57-NQ/TW of the Politburo and the Strategy for the Development of Vietnam's Semiconductor Industry to 2030, with a vision to 2050, as stipulated in Decision No. 1018/QD-TTg of the Prime Minister.
The project, with a total investment of 1,800 billion VND, is being built on an area of 2,288m² with a total floor area of over 5,700m², and is expected to be operational in the fourth quarter of 2026.
The project is divided into two main areas: a lab area for researching new packaging technologies such as FOWLP, 2.5D/3D IC, Silicon Interposer, and Silicon-Bridge; and a fab area for conducting trial production on real wafers, applying modern equipment such as lithography, wafer bonding, and international standard measurement and testing systems. Upon completion, the Fab-Lab is expected to reach a capacity of 10 million products per year, serving both domestic and international markets.

Speaking at the ceremony, Minister of Science and Technology Nguyen Manh Hung emphasized the role of packaging and testing as a strategic link, helping Vietnam participate more deeply in the global semiconductor value chain.
The project is a flexible collaborative model between the State and businesses, with the Lab serving as a center for innovation testing, laying the foundation for training high-quality human resources, attracting investment, and transferring technology.
The Ministry of Science and Technology is committed to working alongside Da Nang in building mechanisms to support research and testing infrastructure, connecting national and international programs in the field of microchip packaging, design, and testing.
Da Nang city leaders also affirmed that the development of science, technology, innovation, and digital transformation is a top priority for the 2025-2030 term. VSAP Lab is expected to become a model "lab-fab" – integrating research, testing, production, and training – serving the packaging of advanced microchips for AI chips, sensors, biomedical devices, and high-speed communication equipment.
The city is committed to creating favorable conditions in terms of infrastructure, administrative mechanisms, and human resources to ensure the project is implemented on schedule, safely, and efficiently. VSAP Lab will be the nucleus of a semiconductor innovation cluster, contributing to the realization of the aspiration to build Da Nang into a high-tech center of the country and the expectation of becoming a "magnet" attracting intellectual talent, the cradle of advanced "Make in Vietnam" packaging technology.
Immediately after the ceremony, the delegation from the Ministry of Science and Technology visited the FPT High-Tech and Semiconductor Chip R&D Center and the integrated circuit design training class at Da Nang Software Park No. 2.
Source: https://baovanhoa.vn/nhip-song-so/da-nang-khoi-dong-du-an-fablab-1800-ti-dong-156911.html






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