The new generation of microprocessor architecture revealed is Intel Core Ultra series 3 (codenamed Panther Lake), opening the era of AI PCs manufactured on the 18A process - the most advanced semiconductor process developed and manufactured by Intel in the US. This is Intel's first chip line built on the 18A platform, combining computing power, graphics processing capabilities and outstanding AI acceleration, targeting AI PC devices, laptops, workstations and edge computing systems.
Panther Lake will officially enter mass production at Fab 52 in Arizona later this year – an important milestone in Intel's strategy to expand manufacturing capacity in the US.

Panther Lake is positioned to become the industry's most widely adopted PC platform.
According to Intel, Panther Lake is the next generation AI PC SoC , designed with a flexible multi-chiplet architecture, making it easy for partners to create products suitable for many different segments. With up to 50% faster CPU performance and 50% more powerful Intel Arc graphics than the previous generation, Panther Lake also stands out with a balanced XPU design, providing AI acceleration of 180 TOPS (trillions of calculations per second) - an outstanding performance level in the AI laptop segment.
“We are entering a new era of computing where AI is present in every platform,” said Lip-Bu Tan , CEO of Intel. “Panther Lake is not just a processor, but the heart of the next generation of AI PCs, born from advanced technology and strong manufacturing capabilities in the US.”
In addition to the consumer chips, Intel also unveiled Clearwater Forest – the first Xeon 6+ server processor on the 18A process , expected to launch in 2026. The product offers the highest power efficiency in Intel history, supports up to 288 E-cores and increases performance per cycle by 17% compared to the previous generation. Both of these product lines demonstrate Intel's "AI-ization" orientation across all layers of computing – from personal devices to data centers.
The Intel 18A process is considered the “backbone” for future generations of AI PC and server products. With the all-new RibbonFET transistor technology and PowerVia back-side power system, this process increases chip density by 30%, improves performance per watt by 15%, and is compatible with Foveros 3D chip packaging technology for flexible integration of AI chiplets, CPUs, and GPUs.
In addition to PCs, Panther Lake will also be used in edge devices, including robotics. The new Intel Robotics AI software suite and reference board enable enterprises with deep AI capabilities to rapidly innovate and cost-effectively develop robots using Panther Lake for both control and AI/cognition.
Panther Lake will enter mass production this year with the first SKUs expected to be delivered to customers before the end of the year and widely available in the market from early January 2026.
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