MediaTek today launched the Dimensity 7200 chip, the company's first chipset in the new Dimensity 7000 series.
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| Dimensity 7200 Chip |
The Dimensity 7200 boasts advanced AI photography features, powerful gaming optimizations, and impressive 5G connectivity speeds, all while maximizing power efficiency for extended battery life.
The chip is designed under the second-generation TSMC 4nm process like the Dimensity 9200 chip, which is the ideal choice for ultra-thin smartphones with various designs. The 8-core CPU, including 2 integrated Arm Cortex-A715 cores with a clock speed of up to 2.8GHz, and 6 Arm Cortex-A510 cores, allows users to multitask easily and get the highest performance in each application. To further optimize power and performance, MediaTek's integrated AI processor (APU) will help maximize the efficiency of AI tasks or AI-assisted tasks.
“The Dimensity 7000 series will be a key player for gamers and photography enthusiasts who are looking for a smartphone that can conserve battery life without sacrificing performance,” said CH Chen, Vice President of MediaTek’s Wireless Communications business unit.
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Additional features of the Dimensity 7200 include: Up to 6400Mbps RAM clock speed and UFS 3.1 storage chip; MediaTek MiraVision display with HDR supporting the latest display standards including HDR10+, CUVA HDR and Dolby HDR; Full HD+ resolution and 144Hz refresh rate for a vibrant display; AI SDR-to-HDR video format support for an enhanced multimedia experience; Bluetooth LE Audio and Dual-Link True Wireless Stereo Audio technology for wireless headphones.
The Dimensity 7200 features a 3GPP Release-16 compliant 5G Sub-6GHz modem with 4.7Gbps downlink and supports tri-band Wi-Fi 6E and next-generation Bluetooth 5.3. The fully integrated 5G modem and MediaTek’s 5G UltraSave 2.0 technology suite ensure best-in-class mobile power efficiency. For reliable coverage wherever you are, the chip supports 2CC carrier aggregation and 5G dual SIM with dual VoNR. Dual SIM capability also allows users to use two connections, making it easy to make work and personal calls from the smartphone.
Dimensity 7200 will be featured in 5G devices that will be launched globally in Q1 2023.
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