MediaTek launches the Dimensity 7200 chip.

16/02/2023 21:51

MediaTek today launched the Dimensity 7200 chip, the company's first chipset in the new Dimensity 7000 series.

Chip Dimensity 7200

The Dimensity 7200 boasts support for advanced AI photography features, powerful gaming optimization, and impressive 5G connectivity speeds, all while maximizing energy efficiency to extend battery life.

The chip, designed using TSMC's second-generation 4nm process, similar to the Dimensity 9200, is an ideal choice for ultra-thin smartphones with various design forms. The 8-core CPU includes two Arm Cortex-A715 cores with clock speeds up to 2.8GHz and six Arm Cortex-A510 cores, allowing users to easily multitask and maximize performance in each application. To further optimize power and performance, MediaTek's integrated AI processing unit (APU) will help maximize the efficiency of AI tasks or tasks assisted by AI.

“The Dimensity 7000 series chips will be crucial for gamers and photographers – users looking for a smartphone with battery-saving capabilities without sacrificing performance,” said CH Chen, Vice President of Wireless Communications at MediaTek.

Additional features of the Dimensity 7200 include: RAM clock speeds up to 6400Mbps and UFS 3.1 memory chips; MediaTek MiraVision display with HDR supporting the latest display standards including HDR10+, CUVA HDR, and Dolby HDR; Full HD+ resolution and 144Hz refresh rate for a vibrant display; Support for AI SDR-to-HDR video format for an enhanced multimedia experience; Bluetooth LE Audio and Dual-Link True Wireless Stereo Audio technology supporting wireless headphones.

The Dimension 7200 features a 3GPP Release-16 standard 5G Sub-6GHz modem with 4.7Gbps downlink and supports tri-band Wi-Fi 6E and next-generation Bluetooth 5.3. The fully integrated 5G modem and MediaTek's 5G UltraSave 2.0 technology ensure best-in-class mobile energy efficiency. For stable coverage anytime, anywhere, the chip supports 2CC carrier aggregation technology and dual 5G SIM with dual VoNR. Dual SIM capability also allows users to use two connections simultaneously, making it easy to make work and personal calls from their smartphone.

Dimensity 7200, featured in 5G devices, will launch globally in Q1 2023.

Source: https://www.sggp.org.vn/mediatek-ra-mat-con-chip-dimensity-7200-post678998.html