As the industry moves towards power densities above 140kW per rack and prepares for data centers with densities of up to 1MW or more, AI chips are increasingly operating at high temperatures and in more dense packaging.
This places an urgent need for efficient cooling technology to maintain optimum performance.

Liquid cooling technology has become a strategic necessity for data centers and AI factories. (Photo: MH)
Liquid cooling is becoming an inevitable strategic solution for modern data centers and AI factories.
Cooling costs can reportedly account for up to 40% of a data center's total power budget. Direct liquid cooling is up to 3,000 times more efficient than air cooling, thanks to its ability to remove heat right at the chip level.
However, the implementation of liquid cooling technology is not simple, requiring a comprehensive approach from technology supply, installation to continuous maintenance.
To meet that need, Schneider Electric, in collaboration with Motivair, introduces the most comprehensive portfolio of cooling and data center infrastructure solutions available today. The solution set includes physical infrastructure equipment such as CDU (Cooling Distribution Unit), RDHx (Rear Door Heat Exchanger), HDU (Heat Dissipation Unit), dynamic cooling panels, chillers and many other devices, combined with specialized software and support services.
All of these products and services are designed to meet the thermal management requirements of next-generation high-performance computing (HPC), AI, and accelerated computing workloads.
“AI is the next technological revolution and has made liquid cooling a strategic imperative for data centers and AI factories,” said Andrew Bradner, Senior Vice President of Schneider Electric’s cooling business.
Source: https://vtcnews.vn/lam-mat-bang-chat-long-giai-phap-then-chot-cho-trung-tam-du-lieu-va-nha-may-ai-ar986388.html






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