Groundbreaking ceremony for 1,800 billion VND semiconductor packaging technology laboratory project

DNVN - On July 28, at Da Nang Software Park No. 2, VSAP LAB Joint Stock Company launched the Laboratory project serving the production of advanced packaging technology for semiconductor microchips, witnessed by the Minister of Science and Technology and leaders of Da Nang City.

Mr. Nguyen Bao Anh - CEO of VSAP Lab Joint Stock Company said that the Laboratory project serving the production of advanced packaging technology (Fab-Lab) has a total investment of 1,800 billion VND, built on an area of ​​nearly 2,300m², with a total usable floor area of ​​more than 5,700m², expected to be put into operation in the fourth quarter of 2026.

Minister of Science and Technology Nguyen Manh Hung, Chairman of Da Nang People's Committee Luong Nguyen Minh Triet and delegates performed the project launching ceremony.

As a pioneer model in Vietnam, with strategic significance in core technology development, the Fab-Lab project is divided into two main areas. Lab area (focusing on research and development of new packaging technologies such as Fan-out Wafer Level Packaging (FOWLP), 2. 2.5D/3D IC, Silicon Interposer and Silicon-Bridge).

Fab room area (conducting trial production on real wafers, with advanced equipment such as lithography, wafer bonding and international standard measuring and testing systems). After completion and operation, the expected design capacity is 10 million products/year, serving domestic and international markets.

According to Minister of Science and Technology Nguyen Manh Hung, packaging and testing play a strategic role, helping Vietnam participate more deeply in the global semiconductor value chain. The Fab-Lab project is a flexible coordination model between the state and enterprises, with the Lab as a center for innovation testing, laying the foundation for training high-quality human resources, attracting investment and transferring technology.

“The Ministry of Science and Technology is committed to working closely with Da Nang City and businesses by supporting the development of investment incentive mechanisms and policies and the development of a semiconductor industrial ecosystem. Facilitating models like VSAP Lab to access investment funds and state-level science and technology tasks. Strengthening connections with international cooperation programs in the fields of research, design, packaging and testing of microchips,” Minister Nguyen Manh Hung emphasized.

Chairman of the Da Nang People's Committee Luong Nguyen Minh Triet said that developing science and technology, innovation and digital transformation are oriented as the city's top breakthroughs in the 2025-2030 term. VSAP Lab is expected to become a model "lab-fab" - integrating research, testing, production and training - serving advanced microchip packaging for AI chips, sensors, biomedicine and high-speed communication devices.

The Da Nang City government affirmed to create favorable conditions in terms of infrastructure, administrative mechanisms and human resources for the project to be implemented on schedule, safely and effectively. The goal is to make VSAP Lab the core of forming a semiconductor industry innovation cluster. Thereby contributing to realizing the aspiration of building Da Nang into a high-tech center of the country and the expectation of becoming a "magnet" attracting brainpower, the cradle of advanced packaging technology "Make in Vietnam".

Hai Chau

Source: https://doanhnghiepvn.vn/cong-nghe/khoi-cong-phong-thi-nghiem-cong-nghe-dong-goi-vi-mach-ban-dan-1-800-ty-dong/20250728120608322