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MediaTek launches new Dimensity 8300 processor, bringing premium experience to 5G smartphones

Báo Sài Gòn Giải phóngBáo Sài Gòn Giải phóng21/11/2023


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Today, November 21, MediaTek announced the Dimensity 8300 processor, an energy-efficient chipset designed for high-end 5G smartphones, which will be equipped for 5G devices launched in the global market before the end of 2023.

MediaTek Dimensity 8300
MediaTek Dimensity 8300

Based on TSMC's second-generation 4nm process, the Dimensity 8300 features an octa-core CPU, with four Arm Cortex-A715 cores and four Cortex-A510 cores built on Arm's latest v9 CPU architecture. Thanks to this powerful core configuration, the Dimensity 8300 delivers 20% faster CPU performance and 30% increased power efficiency compared to the previous generation processor.

In addition, the Dimensity 8300 processor also upgrades the Mali-G615 MC6 GPU, providing up to 60% higher performance and 55% better power efficiency. In addition, the chipset's impressive storage and memory speeds ensure users can enjoy a smooth and vivid experience while playing games, entertainment applications, taking photos and many other applications.

The MediaTek Dimensity 8300 is the first premium SoC to support full generative AI, thanks to the AI ​​APU 780 integrated into the chipset. This allows the Dimensity 8300 to help developers build innovative applications using large language models (LLMs) of up to 10 billion, as well as stable diffusion models. The APU 780 shares the same architecture as the flagship Dimensity 9300 SoC, resulting in double the improvement in INT and FP16 computations and up to 3.3 times the AI ​​performance compared to the Dimensity 8200.

These AI capabilities, combined with MediaTek’s 14-bit HDR-ISP Imagiq 980, will take high-end smartphone photography and video to the next level. Users will be able to capture clearer, more detailed 4K60 HDR photos and record longer videos thanks to the Dimensity 8300’s ultra-power-efficient design.

To further optimize battery life, MediaTek’s next-generation HyperEngine flexible gaming technology delivers advanced power-saving improvements. Leveraging proprietary performance algorithms, the Dimensity 8300 intelligently adjusts to compute demands and monitors device temperature, keeping the device cool while optimizing the gaming experience so users can enjoy full FPS, low latency and smooth rendering.

“With MediaTek’s optimized Dimensity 8000 series, consumers don’t have to choose between convenience and premium experiences like flagship-level memory or enhanced AI capabilities – they can have it all. Meanwhile, the Dimensity 8300 opens up new possibilities for the premium smartphone segment, providing consumers with on-device AI capabilities, immersive entertainment experiences and seamless connectivity without sacrificing performance,” said Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.



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